Samsung introduces new multi-chip package for 5G smartphones

Samsung Electronics has released a new multi-chip package (MCP) memory product for use in 5G smartphones, as the South Korean tech giant tries to better target the fast-growing handset market. The world’s largest memory chip maker said it has rolled out its massive Low-Power Double Data Rate 5 (LPDDR5) Universal Flash Storage (UFS) MCP, which combines high-performance DRAM/DRAM and NAND/DRAM in a single compact package. NAND integrates flash memory chips.

The latest MCP comes with Samsung’s LPDDR5 mobile DRAM, which has 25 gigabytes (Gb) per second read/write speed, which is 1.5 times faster than the previous LPDDR4x. On the other hand, the performance of the UFS 3.1 interface-based NAND flash has been doubled to 3Gb/s compared to the previous Vera 2.2 solutions.

Samsung will be offering various storage capacity options to meet the diverse needs of its customers, with DRAM from 6GB to 12GB and Nand Flash from 128GB to 512GB.
Samsung, which is also the world’s top smartphone vendor, has said that its LPDDR5 UMCP will help users enjoy high-quality 5G content services in a steady state, even when they use low-end devices.

Samsung has said that it has completed qualification testing of LPDDR5 UMCP with several global smartphone manufacturers.
The company expects that its UMCP-equipped devices will be launched in the global market from this month.